Close-Packed Silicon MicroelectrodesScalable, Spatially Oversampled Microelectrodes
for Acute Neural Recording
Close-Packed Silicon Microelectrodes for Scalable Spatially Oversampled Neural Recording
Here you can find the relevant papers, images, design files, software, and best practices involved with the effort to create a scalable electrophyisiology platform.
PublicationsScholvin, et al., "Close-Packed Silicon Microelectrodes for Scalable Spatially Oversampled Neural Recording" IEEE Transactions on Biomedical Engineering
Scholvin, et al., "Heterogeneous Neural Amplifier Integration for Scalable Extracellular Microelectrodes" IEEE EMBC 2016
LinksData acquisition systems (see also below) -- [LeafLabs]
Contact InformationPlease send general inquiries to email@example.com
LeafLabs is producing and distributing FPGA-based neural recording systems that are compatible with our probes. External users of our probe technology can inquire about such systems, as well as our probes, through LeafLabs.
Disclaimer: we (Scholvin, Boyden) have no financial interest in LeafLabs.
This section contains supplementary documents, including images of the devices as well as recordings.
ImagesThe below images are from the paper, but in higher resolution or uncropped. Click on the thumbnails to view the full sized images. The file name of each image indicates the figure from the paper that it is associated with.
Images from the heterogenous integration paper:
Additional ImagesFurther (likely unpublished) images are below:
Neural RecordingsThe below files contain examples of neural data, primarily from the papers. More files will be added over time.
Example spikes (Fig. 12) [CSV]
Single spike on 2x16 channels (Fig. 12) [CSV]
CAD Design Files
This section contains the design files used in microfabrication as well as for the printed circuit boards, for each of the versions of devices we produced. Many aspects of the design involve scales that cross several orders of magnitude, and inspection of the actual design files can be very informative.
Probe Microfabrication - Design FilesThis section links to the GDS-II exports of the Cadence Virtuoso CAD designs. The files are large (>10MB) and have been zipped. Each zip file includes the GDS-II file as well as any supporting documents, for example to identify the layers used.
Design-2014.1: Probes used in process development. [GDS-II File]
Design-2014.2: Final designs for in-vivo validation and used in the paper. [GDS-II File]
Design-EMBC2016: Designs for heterogenous integration interposers from our EMBC paper. [GDS-II File]
Printed Circuit Board - Design FilesThis section links to the Gerber files for the printed circuit boards (PCBs) that we used in the probe packaging. Generally, the PCBs are multi-layer and contain an electroless-nickel-immersion-gold (ENIG) finish to enable wirebonding.
PCB-2014: Gerber files for PCBs with 64 to 1024 pads, combined into a zip file. [Gerber Files] EMBC-2016: Gerber files for PCBs for heterogenous integration of probes and neural amplifiers, combined into a zip file. [Gerber Files]
Suggested Viewing SoftwareTo view Gerber files, we suggest the free and open source GerbV project. [External Link]
To view GDS-II files, we recommend re-importing into the Cadence Virtuoso environment. Alternatively, an open source GDS-II viewer such as Toped can be used. [External Link]